Intel Core Ultra 4000 Series "Nova Lake-H" SoC Surfaces
Intel's "Nova Lake-H" SoC, part of the Core Ultra 4000 Series, has reportedly surfaced.
Why am I seeing this Ranked on source trust — TechPowerUp
It ranks mainly on source trust: TechPowerUp is the most reliable outlet we track on this subject, and is the only one on the story so far.
Single-sourced. No second organisation has confirmed it yet.
Link-outLink-out, because only one organisation carries it and no first-party source is on it. Link-out means we point at the publisher and say nothing of our own.
| Factor | Weight | Score | Contribution | Where it came from |
|---|---|---|---|---|
| Corroboration | 0.35 | 0.39 | +0.135 26% | 1 independent org on the story. Tier-3 aggregators never corroborate — they can show something is circulating, never that it is true. |
| Source trustleads | 0.25 | 0.80 | +0.200 38% | TechPowerUp is the highest-trust source on this story. Trust is taken from the best source, not averaged. |
| Pickup rate | 0.20 | 0.00 | +0.000 0% | One counted organisation, so there is no spread to measure — nothing has picked this up to set a rate. |
| Freshness | 0.20 | 0.97 | +0.193 37% | Halves every 10 hours from the newest item on the story. This is the only factor that rewards a story for nothing more than being recent. |
Corroboration counts distinct organisations, once each, and only from tiers 1 and 2. Freshness halves every 10 hours, so this ranking is a snapshot and will differ at the next build.
Intel's Core Ultra 4000 Series includes a "Nova Lake-H" processor with 4 performance cores, 8 efficiency cores, and 4 low-power efficiency cores on a compute die manufactured using Intel 18A-P technology. The chip measures approximately 12 by 23 millimeters with a total die area of 276 square millimeters.
The package contains multiple specialized dies. A graphics tile built on Intel 3-E includes 4 Xe GPU cores and occupies 26 square millimeters. A 72 square millimeter die on 18A-P hosts the low-power efficiency cores and functions as a central hub for the package.
Additional dies support the overall structure and functionality. A dummy die measuring 21 square millimeters provides structural integrity. An 18A-P peripheral control tile covers 58 square millimeters, while the compute tile containing the performance and efficiency cores occupies 55 square millimeters.
What happened
Intel's "Nova Lake-H" SoC, part of the Core Ultra 4000 Series, has reportedly surfaced. This is a second instance of "Nova Lake-H" surfacing, but this time without third-party annotations, and only coming with the raw, low-resolution SoC picture. This variant features a 4+8+4 configuration with 4 P-Cores, 8 E-Cores, and 4 LPE-Cores on a compute die made using Intel 18A-P technology. The package measures about 12x23 mm, resulting in a total die area of 276 mm², and includes both functional and dummy dies. The first die is the graphics tile, built on the Intel 3-E node, embedding 4 Xe GPU cores and covering roughly 26 mm². Next to it is a dummy die occupying 21 mm², used for the structural integrity of the package.
How this story arrived
Ordered by when each source was first observed, which is what the velocity figure is computed from. Publishers backdate; observed order does not.
- 01 Techpowerup first seen Intel Core Ultra 4000 Series "Nova Lake-H" SoC Surfaces
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